UMC Reports Fourth Quarter 2012 Results

First Quarter of 2013 Outlook & Guidance

Quarter-over-Quarter Guidance:

  • Foundry Segment Wafer Shipment: To increase by approximately 6%
  • Foundry Segment ASP in US$: To decrease by approximately 6%
  • Foundry Segment Profitability: Operating margin to be approximately break-even
  • Foundry Segment Capacity Utilization: Approximately 75%
  • 2013 Foundry CAPEX Budget: US$1.5bn
  • Guidance to Non-Operating Income and New Business Segment:
    • Non-Operating Income after-tax to be approximately US$100mn +
    • New Business Segment revenue to be approximately NT$2bn, and operating margin to be in loss of approximately NT$1bn 

Recent Developments / Announcements

Jan. 29, 2013

STATS ChipPAC and UMC Unveil World's First 3D IC Developed Under An Open Ecosystem Model

Jan. 22, 2013

Faraday and UMC Deliver 300 Million Gate 40nm Customer SoC

Jan. 15, 2013

UMC Introduces Thick Plated Copper Process For Monolithic PMIC Applications

Dec. 26, 2012

UMC Receives ICP Certification From The Bureau of Foreign Trade

Dec. 18, 2012

UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out

Nov. 21, 2012

UMC Unveils 80nm SDDI Foundry Process Featuring The Industry's Most Competitive SRAM Bitcell

Nov. 19, 2012

UMC Restructures Executive Team

Oct. 31, 2012

UMC 3Q 2012 Financial Results

Please visit UMC's website for further details regarding the above announcements

Conference Call / Webcast Announcement

Wednesday, February 06, 2013

Time:       

9:00 PM (Taipei) / 8:00 AM (New York) / 1:00 PM (London)


Dial-in numbers and Access Codes:

USA Toll Free:

1866 519 4004

UK Toll Free:

0808 234 6646

Singapore and Other Areas:   

+65 6723 9381


Access Code:

UMC

A live webcast and replay of the 4Q12 results announcement will be available at www.umc.com under the "Investor Relations \ Investor Events" section.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.


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