Quarter-over-Quarter Guidance:
- Foundry Segment Wafer Shipment: To increase by approximately 6%
- Foundry Segment ASP in US$: To decrease by approximately 6%
- Foundry Segment Profitability: Operating margin to be approximately break-even
- Foundry Segment Capacity Utilization: Approximately 75%
- 2013 Foundry CAPEX Budget: US$1.5bn
- Guidance to Non-Operating Income and New Business Segment:
- Non-Operating Income after-tax to be approximately US$100mn +
- New Business Segment revenue to be approximately NT$2bn, and operating margin to be in loss of approximately NT$1bn
Recent Developments / Announcements
Jan. 29, 2013 |
STATS ChipPAC and UMC Unveil World's First 3D IC Developed Under An Open Ecosystem Model |
Jan. 22, 2013 |
Faraday and UMC Deliver 300 Million Gate 40nm Customer SoC |
Jan. 15, 2013 |
UMC Introduces Thick Plated Copper Process For Monolithic PMIC Applications |
Dec. 26, 2012 |
UMC Receives ICP Certification From The Bureau of Foreign Trade |
Dec. 18, 2012 |
UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out |
Nov. 21, 2012 |
UMC Unveils 80nm SDDI Foundry Process Featuring The Industry's Most Competitive SRAM Bitcell |
Nov. 19, 2012 |
UMC Restructures Executive Team |
Oct. 31, 2012 |
UMC 3Q 2012 Financial Results |
Please visit UMC's website for further details regarding the above announcements
Conference Call / Webcast Announcement
Wednesday, February 06, 2013
Time: |
9:00 PM (Taipei) / 8:00 AM (New York) / 1:00 PM (London) |
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Dial-in numbers and Access Codes: | |
USA Toll Free: |
1866 519 4004 |
UK Toll Free: |
0808 234 6646 |
Singapore and Other Areas: |
+65 6723 9381 |
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Access Code: |
UMC |
A live webcast and replay of the 4Q12 results announcement will be available at www.umc.com under the "Investor Relations \ Investor Events" section.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.