MILPITAS, Calif. — (BUSINESS WIRE) — January 20, 2014 — Silicon360 (Si360), a division of Silicon Turnkey Solutions, is pleased to announce the acquisition of the NXP/IDT High Speed ADC and DAC product portfolio. Silicon360 has extensive full turnkey Engineering, Assembly, Reliability and Test capabilities and, in addition to supporting existing package types, also support custom form factor packages utilizing their internal extensive Die inventory for application specific use (i.e. Ceramic packages).
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Typical ADC/DAC Applications: |
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• Wireless Communications |
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• Satellite Communications |
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• Defense/Aerospace |
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• High Precision GPS |
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• Avionics |
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The ADC’s and DAC’s are offered with 3 choices of digital interfaces: |
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• Low voltage CMOS |
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• LVDS DDR |
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• High speed Giga Bit JESD204A based serial interface |
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High Speed Profile |
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ADC: 65Msps to 250Gsps |
8-bit to 16-bit |
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DAC: 125Msps to 1Gsps |
10-bit to 16-bit |
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High Speed ADC/DAC applications in A&D markets: |
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• Extended qualification and reliability testing |
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• Reference designs include interoperability with Lattice, Altera and Xilinx FPGA’s, universal data acquisition with USB connectivity |
