Premier Conference for Chip, Board and Systems Design Engineers Will Take Place January 19-22, 2016 in Santa Clara, CA

SAN FRANCISCO, May 18, 2015 — (PRNewswire) — DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, today opened the Call for Abstracts (CFA) period for its 2016 event. The country's largest event created for engineers by engineers is seeking technical papers, panels and tutorials that provide practical solutions to the challenging problems shared in design and verification. DesignCon will take place January 19-22, 2016 at the Santa Clara Convention Center in Santa Clara, CA. For more information and to submit your abstract by June 30, visit: designcon.com/santaclara/call-for-abstracts/.

With an emphasis on education and peer-to-peer sharing among practicing engineers, DesignCon creates a unique atmosphere for learning about state-of-the-art design methodologies and technologies. 

The DesignCon Technical Program Committee is seeking abstracts for three types of sessions:

• Technical Papers: 40-minute sessions, up to 25 pages long, addressing design case studies and application overviews (Presentations: January 20-21, 2016)
• Technical Panels: 75-minute presentation/discussion sessions featuring 3-5 panelists plus a panel chair to moderate the discussion (Presentations: January 20-21, 2016)
• Tutorials: 3-hour sessions, papers up to 50 pages long are optional, allowing speakers to cover topics in greater depth (Presentations: January 19, 2016)

Hot Topics for 2016: As systems become more complex, engineers must be increasingly concerned with the quality of the electrical signal at the chip as well as the system level. Additionally, as the use of power distribution networks increases, more designers need to be concerned with power integrity than ever before.

"This year, in addition to our core advanced sessions, we will be making an effort to include sessions, tutorials, and panels that provide an introduction or refresher on some of the issues facing designers in signal integrity, power integrity, or a combination of both," said Janine Love, DesignCon Technical Program Director. "In addition, we are encouraging the submission of more hands-on training as well as plan to offer panels on emerging technologies. And, stay tuned for opportunities for new engineers to get involved with DesignCon."

To stay up-to-date on the latest from DesignCon 2016 and to submit your abstract by the June 30, 2015 deadline, visit: designcon.com/santaclara/call-for-abstracts/.

Follow DesignCon online:

• Facebook: https://www.facebook.com/DesignCon
• Twitter: @UBMDesignCon
• LinkedIn: http://linkd.in/1gfaxOU

About DesignCon
DesignCon, produced by UBM Canon, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country.  This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/.

About UBM Canon
UBM Canon is the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the advanced manufacturing market and leverage our proprietary 1.3 million name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe.  UBM Canon is part of UBM plc (UBM.L) a global provider of media and information services for professional B-to-B communities and markets.

Contact
Kimberly Samra
DesignCon Public Relations
Email Contact

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SOURCE UBM Canon