Time: 10:15 am – 10:55 am
Location: Great America 3
Speakers: Masum Hossain, Senior Principal Engineer, Rambus; Nhat Nguyen, Sr. Director of Engineering, Architecture & Design, Rambus
Title: PCI Express PHY and Controller Integration at Gen4: PLDA’s
Proven Methodology for First-Time Silicon Success
Date:
Wednesday, February 1, 2017
Time: 11:05 am – 11:45 am
Location:
Great America 3
Speaker: Trupti Gowda, Field Application
Engineer, PLDA Inc.
Title: Design and Modelling of 2.5D HBM2 Interposer System
Date:
Wednesday, February 1, 2017
Time: 2:00 pm – 2:40 pm
Location:
Great America 3
Speaker: Yuri Tretiakov, Principal Engineer,
Systems / IC Package Design, Rambus
Title: SI and PI Challenges of a 2.5D HBM2 Interposer System
Date:
Wednesday, February 1, 2017
Time: 2:50 pm – 3:30 pm
Location:
Great America 3
Speakers: Ravi Kollipara, Technical
Director, Engineering, Rambus; Joohee Kim, Senior Member of Technical
Staff II, Rambus
Title: HBM2 Controller and PHY Integration
Date:
Wednesday, February 1, 2017
Time: 3:45 pm – 4:25 pm
Location:
Great America 3
Speaker: Brian Daellenbach, President,
Northwest Logic
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About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
View source version on businesswire.com: http://www.businesswire.com/news/home/20170124006629/en/
Contact:
Rambus Corporate Communications
Agnes Toan, 408-462-8905
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