EL SEGUNDO, Calif. Feb. 2, 2017 -- A new application example describes five tips for successful 3D electromagnetic (EM) simulation of a packaged chip filter using Analyst™ finite-element method simulator within NI AWR Design Environment. This practical guide was developed to help RF/microwave designers ensure accurate results when using Analyst 3D EM to characterize complex structures commonly found in chip, package and board applications where multiple technologies are integrated through a network of interconnects. By applying these straightforward troubleshooting techniques, engineers can easily diagnose their results to ensure that the EM simulation was properly defined.

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The "Five Tips for Successful 3D Electromagnetic Simulation" application example can be downloaded at bit.ly/2jDKqb8.

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