HSINCHU, Taiwan — (BUSINESS WIRE) — April 13, 2017 — TSMC (TWSE: 2330, NYSE: TSM), today filed its 2016 annual report on Form 20-F with the U.S. Securities and Exchange Commission.
The report is available at http://www.tsmc.com/download/ir/secFillings/20F-2016.pdf. Hard copies of the report are also available, free of charge, upon request via http://citibank.ar.wilink.com.
ABOUT TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s owned capacity in 2017 is expected to reach above 11 million (12-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB® facilities, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China. TSMC is the first foundry to provide both 20nm and 16nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.
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Contact:
TSMC Spokesperson
Lora Ho
Senior Vice President & Chief
Financial Officer
TEL: +886-3-5054602
TSMC Acting
Spokesperson
Elizabeth Sun
Senior Director, TSMC Corporate
Communications Division
TEL: +886-3-5682085
Email:
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For
Further Information
Michael Kramer
Project Manager, PR
Department
TEL: +886-3-5636688 Ext. 7125031
Email:
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