• Consumer – Lattice products are being used in the most popular consumer and mobile products. Visit our booth to see what is driving the demand for Lattice solutions in smartphones, VR and other new and exciting product categories! We will be demonstrating our programmable ASSP (pASSP) video bridging solutions and signal aggregation solutions for mobile and IoT applications.
  
  Enjoy a truly unique VR experience and get a hands-on view of the latest product advancements that are making VR more immersive and exciting than ever!

• Industrial & Automotive – Check out how Lattice is creating innovative solutions with low cost, low power mobile influenced technologies optimized for applications such as ADAS, infotainment, industrial IoT, HMI, machine vision, video surveillance, and more. On display will be the latest embedded vision and connectivity demos based on products and technologies including, ECP5™, CrossLink™, and MachXO3™ FPGAs, HDMI® ASSPs, and WirelessHD®.
• Communications – Find out more about 60 GHz wireless infrastructure solutions based on our SiBEAM® technology, which address the need for high capacity wireless links in urban Wi-Fi, LTE and fixed wireless broadband networks.

For editors interested in meeting with Lattice during CES Asia, please contact Lattice@racepointglobal.com in the U.S. or LatticeChina@racepointglobal.com in China to schedule a briefing. To schedule a customer meeting, please visit: http://www.latticesemi.com/en/About/ContactUs.aspx.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) provides smart connectivity solutions powered by our low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. Our unwavering commitment to our customers enables them to accelerate their innovation, creating an ever better and more connected world.

For more information, visit http://www.latticesemi.com/. You can also follow us via LinkedIn, Twitter, Facebook, YouTube or RSS.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), ECP5, pASSP, CrossLink, MachXO3, SiBEAM, WirelessHD and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: All other product names, logos, and brands used in this publication are for identification purposes only and may be trademarks of their respective holders.

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