Microsemi Expands MMIC Portfolio with New Family of Wideband Plastic Packaged and Bare Die GaAs MMIC Devices Offering High Performance From DC to 27 GHz
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Microsemi Expands MMIC Portfolio with New Family of Wideband Plastic Packaged and Bare Die GaAs MMIC Devices Offering High Performance From DC to 27 GHz

New Products to be Showcased at IEEE International Microwave Symposium June 6-8 in Booth 810

ALISO VIEJO, Calif., June 5, 2017 — (PRNewswire) —  Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a new family of wideband plastic packaged and chip monolithic microwave integrated circuit (MMIC) devices. The new products adds to a growing portfolio of high performance wideband MMICs and include four plastic packaged low noise amplifiers (LNAs), MMA040PP5, MMA041PP5, MMA043PP4 and MMA044PP3; a wideband power amplifier (PA) chip, MMA053AA; and two plastic packaged switches, MMS006PP3 and MMS008PP3. The new MMIC products will be showcased at the IEEE International Microwave Symposium (IMS2017) June 6-8, 2017 in Honolulu, Hawaii as a part of Microwave Week 2017.

Microsemi Corporation.  (PRNewsFoto/Microsemi Corporation)

The new packaged amplifiers include two new distributed LNAs (MMA040PP5 and MMA041PP5) which outperform competitive parts over a wider frequency from DC to 27 GHz with higher gain of 17 decibels (dB) and OIP3 of 35 decibel-milliwatts (dBm). They are packaged in a small 5 mm plastic QFN package ideal for size constrained applications. Two additional wideband LNAs (MMA043PP4 and MMA044PP3) provide exceptionally low noise figure (NF) from 0.5 to 18 GHz with typical NF below 2 dB and no more than 2.5 dB at the band edge.

Two new wideband GaAs switches (MMS006PP3 and MMS008PPS) have improved insertion loss and isolation over a wider frequency range from DC to 20 Ghz when compared to competitive parts. These are housed in 3 mm plastic QFN packages which are ideal for high performance requirements in constrained size applications. The devices require minimal off-chip logic to control simplifying system level integration.

A wideband PA chip (MMA053AA) was also released which maintains flat gain of 17 dB and high OIP3 of 35 dBm from DC to 8 GHz, exceeding the performance of competitive parts. Offering superior pricing, customers can leverage all these devices' leading performance capabilities to meet demanding system and module line-up requirements with minimal DC power consumption.

"Our new product introductions represent Microsemi's significant investment in enhancing our MMIC product portfolio as we continue to address our customers' overall requirements," said Kevin Harrington, director of strategic marketing for Microsemi's RF/Microwave Discrete Products business unit. "We are committed to being a long-term trusted supplier of superior performance MMIC products for our customers as we continue to invest and expand leading-edge MMIC devices."

Microsemi's new MMIC wideband LNA, distributed wideband MMIC power amplifier and wideband MMIC switches are ideal for a number of front-end signal chain applications within the aerospace, defense and industrial markets, including test and measurement, electronic warfare (EW)/electronic countermeasures/electronic counter-countermeasures, high linearity microwave radio, and unmanned aerial vehicle (UAV) and other military communications applications. Global market research and consulting company Strategy Analytics estimates that GaAs MMICs sold into the EW, radar and microwave communications markets will reach $500 million by 2019.

Key features of the new MMIC devices include:


MMS006PP3 Switch


MMS008PP3 Switch


MMA040PP5 LNA

DC-20 GHz single pole, double throw (SPDT) switch in 3x3 mm QFN plastic package

DC-8GHz single pole four throw (SP4T) switch in 3x3 mm QFN plastic package

DC-27 GHz distributed LNA in 5x5 mm QFN plastic package

Evaluation board:
MMS006PP3E

Evaluation board:
MMS008PP3E

Evaluation board: MMA040PP5E  


MMA041PP5 LNA


MMA043PP4 LNA


MMA044PP3 LNA

DC-25 GHz distributed LNA in 5x5 mm QFN plastic package

0.5-12 GHz Wideband LNA in 4x4 mm QFN plastic package

6-18 GHz LNA in 3x3 mm QFN plastic package

Evaluation board:
MMA041PP5E

Evaluation board:
MMA043PP4E

Evaluation board: MMA044PP3E


MMA053AA PA




DC-8 GHz distributed PA Chip




As a leader in MMIC products, Microsemi continues to expand its portfolio, which spans the DC to 65 GHz frequency range and targets a broad range of applications including those in EW, radar, test and measurement instrumentation, and microwave communications. These new products build upon a growing portfolio of high performance broadband MMIC amplifiers, control products, prescalers, and phase frequency detectors, ensuring customers can meet highly specific and complex MMIC requirements, with future high performance product developments planned to further enhance Microsemi's MMIC product offerings. 

Product Availability
Microsemi's new family of MMIC devices—including the four wideband LNAs (MMA040PP5, MMA041PP5, MMA043PP4 and MMA044PP3), a distributed wideband PA chip (MMA053AA) and two plastic packaged switches (MMS006PP3 and MMS008PP3)—are sampling now. For more information, visit https://www.microsemi.com/products/mmic/mmic or contact sales.support@microsemi.com.

About Microsemi's RF/Microwave Product Portfolio
Microsemi offers an industry-leading portfolio of RF and microwave solutions for aerospace and defense, communications and industrial applications. Microsemi's portfolio includes Forever MMICs, PIN diodes, varactor diodes, RF Schottky diodes, ultralow power radios, Wi-Fi front-end modules, RF GaN transistors, RF industrial, scientific and medical (ISM) vertical diffusion metal oxide semiconductor (VDMOS) transistors and more. For more information about Microsemi's RF/microwave product portfolio visit https://www.microsemi.com/product-directory/973-rf-microwave-a-millimeter-wave.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new family of wideband plastic packaged and chip MMIC devices, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs in implementing the company's acquisitions and divestitures strategy or integrating acquired companies, uncertainty as to the future profitability of acquired businesses and realization of accretion from acquisition transactions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

 

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SOURCE Microsemi Corporation

Contact:
Microsemi Corporation
Farhad Mafie, VP Worldwide Product Marketing, 949-356-2399; Beth P. Quezada, Director, Corporate Communications, 949-380-6102; Email Contact
Web: http://www.microsemi.com