Lattice and Helion Accelerate Embedded Vision Designs with Turnkey ISP Solution
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Lattice and Helion Accelerate Embedded Vision Designs with Turnkey ISP Solution

FPGA-based Embedded Vision Development Kit Available Now at $199 USD for a Limited Time

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PORTLAND, Ore. — (BUSINESS WIRE) — October 2, 2017Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, and HelionVision® today announced the latest solution to expedite embedded vision design and prototyping. The free evaluation version of Helion’s latest pre-packaged IONOS™ image signal processing (ISP) options for Lattice’s Embedded Vision Development Kit expedites the IP selection process, reduces development time and accelerates time-to-market. This collaboration creates a complete hardware and software solution for embedded vision applications in Industry 4.0 applications, robotics, drones, automotive, AR and intelligent cameras for smart cities.

The long-term partnership between Lattice and Helion focuses on creating solutions based on years of accumulated customer engagements. Lattice’s first-of-its-kind development kit combines CrossLink™ video bridging FPGA, ECP5™ processing FPGA and high-resolution HDMI® ASSP into a single, modular platform, along with Helion’s pre-packaged ISP options. This complete solution simplifies the development of advanced applications at the edge.

“With its new Embedded Vision Kit, Lattice is addressing the need for rapid development and simplicity of connectivity solutions in a fast growing intelligent systems market,” said Dr.-Ing. Arndt Bußmann, CTO at Helion Vision. “Our ISP solutions and design services are ideal for customized camera systems, imaging modules and complete camera and display systems, and we look forward to continuing our work with Lattice to expand upon future intelligent edge systems.”

Key features of Helion’s ISP cores include:

“Our Embedded Vision Development Kit accelerates system design through rapid prototyping and simplified testing. It is ideal for applications such as augmented reality, medical, machine vision required in Industry 4.0, surround view cameras in smart automotive and intelligent traffic cameras in smart cities,” said Dirk Seidel, senior marketing manager at Lattice. “Helion’s IONOS ISP pipelines add even more value to our offerings by allowing our customers easy access to Helion's expert knowledge in research and development within the image signal processing and embedded vision design industry.”

In conjunction with this partnership announcement, Lattice will be offering the Embedded Vision Development Kit for a special promotional price of $199 USD from Oct. 2, 2017 – March 30, 2018. For more information on the Embedded Vision Development Kit and to download the free evaluation version of Helion’s IONOS ISP, please visit http://www.latticesemi.com/evdkit.

Lattice at the CEATEC Japan 2017 – Chiba, Japan

Lattice will be showcasing its Embedded Vision Development Kit, along with its latest connectivity solutions for the consumer, industrial, automotive and communications markets at Hall 5, booth #D-145 at the Makuhari Messe from Tuesday, October 3, 2017 - Friday, October 6, 2017.

For editors interested in meeting with Lattice during CEATEC Japan 2017, please contact Lattice@racepointglobal.com in the U.S. or sunaga@noisegate.co.jp in Japan. To schedule a customer meeting, please visit: http://www.latticesemi.com/en/About/ContactUs.aspx.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) provides smart connectivity solutions powered by our low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. Our unwavering commitment to our customers enables them to accelerate their innovation, creating an ever better and more connected world.

For more information about Lattice please visit  www.latticesemi.com. You can also follow us via  LinkedInTwitterFacebookYouTube, WeChat, Weibo or  Youku.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and CrossLink, ECP5 and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. The use of the word “partner” does not imply a legal partnership between Lattice and any other entity.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.



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