LAS VEGAS — (BUSINESS WIRE) — January 7, 2019 — On the eve of CES, Intel leaders – Gregory Bryant, senior vice president, Client Computing Group; Navin Shenoy, executive vice president, Data Center Group; and Professor Amnon Shashua, president and CEO of Mobileye, an Intel company – took to the stage to showcase the company’s commitment to continuously improve the computing and communications foundation that will advance the way we experience the world and expand human potential.
More: Intel at 2019 CES (All Intel News)
The company made several announcements spanning PCs and new devices to diverse growth segments including artificial intelligence (AI), 5G and autonomous driving (AD). And Intel’s leaders discussed the innovation necessary across the data center, cloud, network and edge to enable the new user experiences and form factors of the future.
Intel showcased its latest Intel® Xeon® Scalable products, shipping today with advanced AI and memory capabilities, and 9th Gen Intel® Core™ desktop products. It also announced new 10nm products for PCs, servers and 5G wireless access base stations, the future of new chip designs based on its 3D packaging technology (Foveros).
Intel also spotlighted what’s possible when technologies work seamlessly together across the entire spectrum of computing. Comcast* and Intel are working together to bring the connected home to life. New initiatives with Alibaba* demonstrate how Intel AI plans to deliver athlete tracking technology during the next Olympics. Mobileye and Ordnance Survey* will bring us closer to the realization of smart cities and safer roads.
“Anyone can claim leadership in an isolated use case, but at Intel
our aim is broader. The next era of computing demands innovation at an
entirely different level – one that encompasses the entire ecosystem and
spans every facet of computing, connectivity and more. We won’t settle
for anything less.”
–Gregory Bryant
THE CHANGING FACE OF COMPUTING
Driving Innovation across the PC Industry: Intel’s Client Computing Group is uniquely positioned to innovate across the industry because of its broad set of technologies under one roof, enabling Intel to advance the PC and deliver the foundation for the data-centric world today.
- New mobile PC platform with “Ice Lake”: The vision for tomorrow’s mobile PC platform is firmly aligned with Intel’s upcoming first volume 10nm PC processor, code-named “Ice Lake.” Ice Lake brings a new level of integration with Intel’s new Sunny Cove microarchitecture, instruction sets to accelerate AI usage and a graphics engine, and Intel Gen11 graphics to improve graphics performance for richer gaming and content creation experiences. Intel’s OEM partners are expected to have new devices with Ice Lake on shelves by holiday 2019.
- Project Athena: Intel also announced Project Athena, an innovation program and new set of industry specifications developed to help usher in a new class of advanced laptops designed to enable new experiences and capitalize on next-generation technologies, including 5G and artificial intelligence. From delivering the first connected PC with integrated Wi-Fi in the Intel® Centrino® platform to driving mainstream adoption of super thin and light designs, touchscreens, and 2 in 1 form factors with Ultrabook™, Intel is uniquely positioned to be the catalyst in delivering the next-gen PC experience. Combining world-class performance, battery life and connectivity in sleek, beautiful designs, the first Project Athena devices are expected to be available in the second half of this year.
- “Lakefield” preview: Intel is accelerating client innovation by taking new approaches to hybrid CPU architecture and packaging technologies. At CES 2019, Intel provided a sneak peek of a new client platform, code-named “Lakefield,” featuring the first iteration of its Foveros 3D packaging technology. This hybrid CPU architecture enables combining different pieces of IP that might have previously been discrete into a single product with a smaller motherboard footprint, which allows OEMs more flexibility for thin and light form factor design. Lakefield is expected to be in production this year.
- Expanding 9th Gen Intel® Core™ desktop family: Intel introduced new additions to the 9th Gen Intel Core processors that expand the family for a broader spectrum of desktop products. These processors deliver world-class performance to unlock incredible new capabilities and experiences for content creators and gamers at all levels. The first of the new 9th Gen Intel Core desktop processors is expected to be available starting this month.
Powering the Data-Centric World across the Cloud, Network and Edge: Intel’s
Data Center Group is transforming industries by delivering unparalleled
assets that allow customers to move, store and process massive amounts
of untapped data.
