Company to demonstrate next-generation high-speed, high-density networking solutions needed for the infrastructure of tomorrow’s optical networks

LISLE, Ill. — (BUSINESS WIRE) — March 5, 2019 — Molex will feature several next-generation optical interconnect, wavelength management, optoelectronic and optical subsystem solutions for dynamic high-bandwidth telecommunications and network solutions at the Optical Networking and Communication Conference and Exhibition (OFC), March 5-7, 2019 at the San Diego (CA) Convention Center in booth 2807.

“By combining our core technologies with additional complementary capabilities from our acquisitions and venture investments, we are proud to offer our customers a strong portfolio of innovative optical solutions to meet their needs today and in the future. At OFC 2019, we are excited to highlight those combined solutions including high-speed optical transceivers, flexible and scalable optical transport products, compact connectors and fiber management, which are all vital capabilities to building high-bandwidth and high-density communication equipment needed to serve telecom, enterprise and hyperscale data centers,” said Doug Busch, vice president and general manager, optical solutions at Molex.

To help build the infrastructure of tomorrow’s optical networks, Molex will feature several public and private demos, including:

• OptoConnect Optical Enclosures – OptoConnect optical management solutions simplify complex fiber mapping while greatly reducing intra-system cabling footprints in advanced network architectures.
• Fiber Management Solutions for COBO Based Optical Engines – A COBO* module-based reference layout board including high-density front panel Optical EMI shielding adapters, blind mating optical backplane interconnects and on-card optical cabling featuring FlexPlane technology will highlight how system vendors can implement COBO on board optical module-based architectures.
  *For more COBO-related information, visit the consortium for on board optics at booth 1817.

• Dirac – Is the latest offering of high-port-count WSS for route-and-select architectures that demand 32+ ports.
• BittWare, a Molex Company, will preview its SVL-29P – a PCIe board with dual 400G-compatible ports directly connected to a Xilinx VU29P FPGA. This FPGA utilizes the new 58 Gbps PAM-4 transceivers. The low-profile SVL-29P is an excellent board for those who want to get a head-start on 400G FPGA-based designs.
• Molex will demonstrates interoperability of its 400G DR4, 100G optics modules and 3m QSFP-DD DAC cables with Cisco N3432D-S switch, Innovium TERALYNX^TM Switch and Keysight Technologies IXIA AresONE.

The following demos are by appointment only. Please contact Molex to schedule.

• C+L band EDFA and Raman Amplifier will highlight how a compact, low-loss DGE can greatly reduce accumulated gain error, eliminate dynamic gain ripple and lower the noise figure.
• Molex will demonstrate its coherent module capable to achieve 400G transmission and low power consumption. Performances under 16-QAM modulation at 60G baud rates will be shown in real-time for critical parameters.

Molex will also participate in speaking engagements:

• In a session organized by the Consortium for On-Board Optics (COBO), Molex’s Tom Marrapode will join other COBO members presenting on topics related to on board optical modules. This will include development in systems and sub-systems discussing both electrical and optical interconnects. The session will take place Wednesday, March 6, 2019 from 10:15-11:45AM in Theater II, Hall E.
• Molex’s Tom Strasser will teach the ever popular foundational course on Reconfigurable Networks, SC 261: ROADM Technologies and Network Applications on Monday, March 4, 2019.

Molex joins other Optical Internetworking Forum (OIF) members attending OFC 2019 to showcase interoperability of Common Electrical Interface (CEI) solutions over a range of channel reaches and modulations. Live technology demonstrations featuring Molex solutions include:

• Cables with Connector/Cage and Cables Demo
  A baseline draft of the CEI 112G LR Implementation Agreement has been developed. This demonstration, which establishes early stage feasibility for this topology, utilizes Molex’s QSFP-DD (Double Density) passive copper cable.

• CEI-112G-VSR SerDes with Module demo incorporates multiple silicon supplier products operating over a 112 Gbps PAM-4 VSR (chip-to-module) link. This demo utilizes Molex’s QSFP-DD, a CEI-112G-VSR interface, to electrically drive interoperating HCB/MCB test boards.

Please visit the Molex booth at OFC 2019 or  https://www.connector.com/solutions/ofc to explore a robust portfolio of next-generation, high-speed, high-density optical solutions. To learn more about how you can become a part of the Molex innovation, please visit booth 5349 in the Career Zone.

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit  www.molex.com.

Molex Resources:

• Learn more about Molex at www.molex.com
• Follow us at www.twitter.com/molexconnectors
• Watch our videos at www.youtube.com/molexconnectors
• Connect with us at www.facebook.com/molexconnectors
• Read our blog at www.connector.com

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.

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