“As we move into the era of More than Moore, multi-physics simulations are becoming increasingly important to our future chip and system designs,” said Catherine Xia, senior director of platform technology at HiSilicon. “Legacy 3D field solver technology has been incapable of meeting our requirements for simulating the entire system, including chip, package, PCB and enclosure. We are very excited to see the breakthrough performance and capacity introduced by the Cadence Clarity 3D Solver, and we look forward to more system-level simulation innovations from Cadence.”
“Our newly formed System Analysis Group is breaking new ground on next-generation algorithms to solve the most difficult electromagnetic challenges across ICs, packages, boards and complete systems,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “This first major technology breakthrough, the Clarity 3D Solver, expands Cadence’s product portfolio beyond traditional EDA—furthering our System Design Enablement strategy and enabling us to expand our system portfolio and market opportunities. With the Clarity 3D Solver, semiconductor and systems companies can address system-level problems for a broad spectrum of today’s most challenging applications including 112G communication networks, IoT, automotive/ADAS, and other complex high-speed electronic systems.”
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. Learn more at cadence.com.
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