Additional Resources
- Learn more about 2nd Gen AMD EPYC Processors
- Learn more about software and workload support for the AMD EPYC 7Fx2 processors from the AMD blog
- Learn more from Micron about their views and experiences with the AMD EPYC 7Fx2 processors
- Follow AMD data center developments on Twitter @AMDServer
About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD)
website,
blog,
Facebook and
Twitter pages.
Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the features, functionality, availability, timing and expectations of the 2nd Gen AMD EPYC™ processors, including expectations with existing OEMs and new partners, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "intends," "believes," "expects," "may," "will," "should," "seeks," "intends," "plans," "pro forma," "estimates," "anticipates," or the negative of these words and phrases, other variations of these words and phrases or comparable terminology. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices may limit AMD’s ability to compete effectively; AMD relies on third parties to manufacture its products, and if they are unable to do so on a timely basis in sufficient quantities and using competitive technologies, AMD’s business could be materially adversely affected; failure to achieve expected manufacturing yields for AMD’s products could negatively impact its financial results; the success of AMD’s business is dependent upon its ability to introduce products on a timely basis with features and performance levels that provide value to its customers while supporting and coinciding with significant industry transitions; if AMD cannot generate sufficient revenue and operating cash flow or obtain external financing, it may face a cash shortfall and be unable to make all of its planned investments in research and development or other strategic investments; the loss of a significant customer may have a material adverse effect on AMD; AMD’s receipt of revenue from its semi-custom SoC products is dependent upon its technology being designed into third-party products and the success of those products; global economic uncertainty may adversely impact AMD’s business and operating results; AMD’s operations are subject to political, legal and economic risks and natural disasters which could have a material adverse effect on AMD; government actions and regulations such as export administration regulations, tariffs and trade protection measures, may limit AMD’s ability to export its products to certain customers; AMD products may be subject to security vulnerabilities that could have a material adverse effect on AMD; IT outages, data loss, data breaches and cyber-attacks could compromise AMD’s intellectual property or other sensitive information, be costly to remediate and cause significant damage to its business and reputation; AMD has a wafer supply agreement with GF with obligations to purchase all of its microprocessor and APU product requirements, and a certain portion of its GPU product requirements, from GLOBALFOUNDRIES Inc. (GF) with limited exceptions. If GF is not able to satisfy AMD’s manufacturing requirements, its business could be adversely impacted; uncertainties involving the ordering and shipment of AMD’s products could materially adversely affect it; AMD’s operating results are subject to quarterly and seasonal sales patterns; the agreements governing AMD’s notes and the Secured Revolving Line of Credit impose restrictions on AMD that may adversely affect its ability to operate its business; the markets in which AMD’s products are sold are highly competitive; the conversion of the 2.125% Convertible Senior Notes due 2026 may dilute the ownership interest of its existing stockholders, or may otherwise depress the price of its common stock; the demand for AMD’s products depends in part on the market conditions in the industries into which they are sold. Fluctuations in demand for AMD’s products or a market decline in any of these industries could have a material adverse effect on its results of operations; AMD’s ability to design and introduce new products in a timely manner is dependent upon third-party intellectual property; AMD depends on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components to support its business; if AMD loses Microsoft Corporation’s support for its products or other software vendors do not design and develop software to run on AMD’s products, its ability to sell its products could be materially adversely affected; and AMD’s reliance on third-party distributors and AIB partners subjects it to certain risks. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Annual Report on Form 10-K for the year ended December 28, 2019.
AMD, the AMD Arrow logo, EPYC and combinations thereof, are trademarks of Advanced Micro Devices, Inc. ANSYS, CFX and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. Microsoft and SQL Server are trademarks or registered trademarks of Microsoft Corporation in the US and other jurisdictions. PCIe is a registered trademark of PCI-SIG Corporation. TPC, TPC Benchmark and TPC-C are trademarks of the Transaction Processing Performance Council. VMmark®, VMware® and vSAN™ are trademarks or registered trademarks of VMware in the US or other countries. Other names are for informational purposes only and may be trademarks of their respective owners.
*AMD EPYC™ 7F32 SPECrate®2017_fp_base score
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i Highest per core performance in the world based on EPYC 7F32 (8-cores) having the highest SPECrate®2017_fp_base score divided by total core count, of all SPEC® publications as of 4/14/2020. 2x EPYC 7F32 (8-cores) scoring 12.75 base result per core (204 SPECrate®2017_fp_base/16 total cores, www.spec.org/cpu2017/results/res2020q2/cpu2017-20200316-21244.pdf) compared to the next highest result 1x AMD EPYC 7262 (8-cores) scoring 11.54 base result per core (92.3 SPECrate®2017_fp_base/8 total cores, http://spec.org/cpu2017/results/res2020q1/cpu2017-20191220-20435.pdf) See www.spec.org/cpu2017/results for full ranking. SPEC® and SPECrate® are trademarks of the Standard Performance Evaluation Corporation. Learn more at www.spec.org ROM-570
ii Testing as of 3.20.2020 by AMD Performance Labs. Up to 17% higher SQL Server® tpm per core. Configurations: HammerDB 3.3 (TPC-C® profile - The workload is derived from the TPC-C Benchmark, and as such is not comparable to published TPC-C Benchmark results, as the OLTP workload results do not comply with the TPC-C benchmark). 2x EPYC 7F52 (32C total) scoring 4,872,975 tpm (152,280 tpm per core). 2x Xeon Gold 6244 (32C total) scoring 4,178,963 tpm (130,584 tpm per core). Results may vary. ROM-571
iii 47% higher score amd 56% more tiles (VMs) based on VMmark® 3.1 vSAN™ comparing 2x EPYC 7F72 scoring 13.27 @ 14 tiles (266 VMs),
https://www.vmware.com/content/dam/digitalmarketing/vmware/en/pdf/vmmark/2020-04-14-DellEMC-PowerEdge-R6525.pdf compared to the next highest competitive result on 2x Intel® Xeon® Platinum 8276L scoring 9.00 @ 9 tiles (171 VMs),
https://www.vmware.com/content/dam/digitalmarketing/vmware/en/pdf/vmmark/2019-08-12-Hitachi-UCPHC-V124N.pdf ). 47% higher score = 13.27/9 = 1.474x the score and 56% more tiles (VMs) = 14/9=1.555x the tiles (VMs) as of 4/14/20. VMmark® is a product of VMware, Inc. ROM-639
