Flextronics Semiconductor Selects Advanced Interconnect Technologies for Dual Chip QFN Package for Consumer Electronics Application; AIT's Robust QFN Packages Provide Superior Performance and Small Footprint
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Flextronics Semiconductor Selects Advanced Interconnect Technologies for Dual Chip QFN Package for Consumer Electronics Application; AIT's Robust QFN Packages Provide Superior Performance and Small Footprint

SINGAPORE—(BUSINESS WIRE)—June 20, 2005— Advanced Interconnect Technologies (AIT) today announced that Flextronics Semiconductor has chosen AIT's QFN package for its devices used in next generation consumer electronics applications. Utilizing AIT's QFN package, Flextronics will benefit from features of reduced footprint and improved performance.

In addition, AIT will provide a turnkey service that includes assembly, final test and tape and reel services for Flextronics. AIT's QFN packages have been selected due to their superior electrical and thermal performance.

"AIT's QFN package enables us to leverage power, footprint and performance that renders improved reliability while catering to the fast growing consumer electronics market," said Arnold Virrey, packaging manager at Flextronics Semiconductor. "Our long term relationship with AIT as well as their ability to offer a complete turnkey solution that includes assembly, test and tape and real services made them a natural choice."

"Flextronics' use of AIT's QFN package design further demonstrates our ability to assist customers by delivering an array of competitive advantages in size, power and performance," said Rodger Fujinaga, vice president of North American sales at AIT. "With our advanced packaging solutions, we are raising the bar in performance, ease, compatibility and physical design."

QFN packages are superior to traditional leaded packages because they do not have gull wing leads which can act as antennas and create "noise" in high frequency applications. In addition, the QFN package also provides better thermal performance because of its exposed leadframe pad, which provides a direct path for removing heat from the package.

About Advanced Interconnect Technologies (AIT)

Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers. The company is also ISO 9001:2000, ISO 14001 and QS9000 certified. With approximately 3,600 employees worldwide, AIT has factory locations in Batam, Indonesia and Sunnyvale, Calif. The company is headquartered in Singapore. For more information about the company, its products and services please visit their website at www.aithome.com.



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