SEMI Taiwan Launches Rating Service to Strengthen Cybersecurity Across Taiwan Chip Ecosystem
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SEMI Taiwan Launches Rating Service to Strengthen Cybersecurity Across Taiwan Chip Ecosystem

HSINCHU, Taiwan – December 13, 2022 – Taking aim at hardening the Taiwan semiconductor ecosystem’s defenses against cyberattacks, SEMI has launched a Semiconductor Cybersecurity Risk Rating Service. Using third-party risk scoring and risk posture assessment, the service is designed to help SEMI Taiwan members assess cybersecurity risks in real time and provide risk remediation guidance. Launched by the SEMI Taiwan Cybersecurity Committee, the service was developed by SEMI Taiwan, Taiwan Semiconductor Manufacturing Company (TSMC) and other semiconductor industry partners.

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“The new SEMI Semiconductor Cybersecurity Risk Rating Service will help Taiwan semiconductor companies bolster their cyber defenses as they deploy smart manufacturing practices that rely on greater connectivity both inside and outside of chip fabs,” said Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan. “Crucially, the service will also facilitate cybersecurity decision-making as semiconductor companies work with their supply chain partners.”

“Ever since we helped our suppliers adopt the assessment and security rating mechanism that is the foundation of the SEMI Semiconductor Cybersecurity Risk Rating Service, many security vulnerabilities have been exposed and repaired in a timely manner,” Dr. James Tu, Chairman of the SEMI Taiwan Cybersecurity Committee and Head of Corporate Information Security at TSMC. “This important service not only helps semiconductor companies monitor their suppliers' cybersecurity status, but also makes possible the comparison of supply chain cybersecurity standards and benchmarking.”

SEMI Semiconductor Cybersecurity Risk Rating Service – 5 Features

The introduction of the SEMI Semiconductor Cybersecurity Risk Rating Service follows SEMI Taiwan’s January 2022 release of SEMI E187, the world's first cybersecurity standard for fab equipment. 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit  www.semi.orgcontact one of our worldwide offices, and connect with SEMI on LinkedIn and  Twitter to learn more.

Association Contacts

Monica Hung/SEMI Taiwan
Email:  mhung@semi.org
Phone: +886.3.560.1777 ext. 207

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: mhall@semi.org