QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries™ 22FDX® Platform

Industry Leaders Gather in Europe for GF Technology Summit 2023

Samsung Electronics’ Industry-First LPCAMM Ushers In Future of Memory Modules

GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding

proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem

FLEX LOGIX EXPANDS UPON INDUSTRY-LEADING EMBEDDED FPGA CUSTOMER BASE

Dan Fernback, VP JuggerBot 3D

Emmanuel Leroy, EVP ESI Group

Nick Florek, CEO General Lattice

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Shape Your World by Sanjay Gangal Manufacturing and Innovation at the Forefront: Autodesk’s Vision for the Future

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Engineer 2 for Lam Research at Fremont, California

Equipment Engineer, Raxium for Google at Fremont, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025