Intel also announced collaborations with Google Cloud, Thales and Cohesity to leverage Intel's confidential computing capabilities in their cloud instances. This includes Intel® Trust Domain Extensions (Intel® TDX), Intel® Software Guard Extensions (Intel® SGX) and Intel’s attestation service. Customers can run their AI models and algorithms in a trusted execution environment (TEE) and leverage Intel’s trust services for independently verifying the trust worthiness of these TEEs.

Ecosystem Rallies to Develop Open Platform for Enterprise AI

In collaboration with Anyscale, Articul8, DataStax, Domino, Hugging Face, KX Systems, MariaDB, MinIO, Qdrant, RedHat, Redis, SAP, VMware, Yellowbrick and Zilliz, Intel announced the intention to create an open platform for enterprise AI. The industrywide effort aims to develop open, multivendor GenAI systems that deliver best-in-class ease-of-deployment, performance and value, enabled by retrieval-augmented generation. RAG enables enterprises’ vast, existing proprietary data sources running on standard cloud infrastructure to be augmented with open LLM capabilities, accelerating GenAI use in enterprises.

As initial steps in this effort, Intel will release reference implementations for GenAI pipelines on secure Intel Xeon and Gaudi-based solutions, publish a technical conceptual framework, and continue to add infrastructure capacity in the Intel Tiber Developer Cloud for ecosystem development and validation of RAG and future pipelines. Intel encourages further participation of the ecosystem to join forces in this open effort to facilitate enterprise adoption, broaden solution coverage and accelerate business results.

Intel's Expanded AI Roadmap and Open Ecosystem Approach

In addition to the Intel Gaudi 3 accelerator, Intel provided updates on its next-generation products and services across all segments of enterprise AI.

New Intel® Xeon® 6 Processors: Intel Xeon processors offer performance-efficient solutions to run current GenAI solutions, including RAG, that produce business-specific results using proprietary data. Intel introduced the new brand for its next-generation processors for data centers, cloud and edge: Intel Xeon 6. Intel Xeon 6 processors with new Efficient-cores (E-cores) will deliver exceptional efficiency and launch this quarter, while Intel Xeon 6 with Performance-cores (P-cores) will offer increased AI performance and launch soon after the E-core processors.

• Intel Xeon 6 processors with E-cores (code-named Sierra Forest):
  • 4x performance per watt improvement⁴ and 2.7x better rack density⁵ compared with 2nd Gen Intel® Xeon® processors.
  • Customers can replace older systems at a ratio of nearly 3-to-1, drastically lowering energy consumption and helping meet sustainability goals⁶.
• Intel Xeon 6 processors with P-cores (code-named Granite Rapids):
  • Incorporate software support for the MXFP4 data format, which reduces next token latency by up to 6.5x versus 4th Gen Intel® Xeon® processors using FP16, with the ability to run 70 billion parameter Llama-2 models⁷.

Client, Edge and Connectivity: Intel announced momentum for client and updates to its roadmap for edge and connectivity including:

• Intel® Core™ Ultra processors are powering new capabilities for productivity, security and content creation, providing a great motivation for businesses to refresh their PC fleets. Intel expects expect to ship 40 million AI PCs in 2024, with more than 230 designs, from ultra-thin PCs to handheld gaming devices.
• Next-generation Intel Core Ultra client processor family (code-named Lunar Lake), launching in 2024, will have more than 100 platform tera operations per second (TOPS) and more than 45 neural processing unit (NPU) TOPS for next-generation AI PCs.
• Intel announced new edge silicon across the Intel Core Ultra, Intel® Core™ and Intel® Atom processor and Intel® Arc™ graphics processing unit (GPU) families of products, targeting key markets including retail, industrial manufacturing and healthcare. All new additions to Intel’s edge AI portfolio will be available this quarter and will be supported by the Intel® Tiber™ Edge Platform this year.
• Through the Ultra Ethernet Consortium (UEC), Intel is leading open Ethernet networking for AI fabrics, introducing an array of AI-optimized Ethernet solutions. Designed to transform large scale-up and scale-out AI fabrics, these innovations enable training and inferencing for increasingly vast models, with sizes expanding by an order of magnitude in each generation. The lineup includes the Intel AI NIC, AI connectivity chiplets for integration into XPUs, Gaudi-based systems, and a range of soft and hard reference AI interconnect designs for Intel Foundry.

Intel Tiber Portfolio of Business Solutions

Intel unveiled the Intel® Tiber™ portfolio of business solutions to streamline the deployment of enterprise software and services, including for GenAI.

A unified experience makes it easier for enterprise customers and developers to find solutions that fit their needs, accelerate innovation and unlock value without compromising on security, compliance or performance. Customers can begin exploring the Intel Tiber portfolio starting today, with a full rollout planned for the third quarter of 2024. Learn more at Intel Tiber website.

Intel's announcements at Vision 2024 underscore the company's commitment to making AI accessible, open and secure for enterprises worldwide. With these new solutions and collaborations, Intel is poised to lead the way in the AI revolution, unlocking unprecedented value for businesses everywhere.

For more information on Intel's AI solutions and Vision 2024 announcements, please visit the Intel Newsroom.

Forward-Looking Statements

This release contains forward-looking statements, including with respect to:

• our business plans and strategy and anticipated benefits therefrom;
• our AI strategy and AI accelerators;
• our open platforms approach and ecosystem support with respect to AI; and
• other characterizations of future events or circumstances.

Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including those associated with:

• the high level of competition and rapid technological change in our industry;
• the significant long-term and inherently risky investments we are making in R&D and manufacturing facilities that may not realize a favorable return;
• the complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies;
• our ability to time and scale our capital investments appropriately and successfully secure favorable alternative financing arrangements and government grants;
• implementing new business strategies and investing in new businesses and technologies;
• changes in demand for our products;
• macroeconomic conditions and geopolitical tensions and conflicts, including geopolitical and trade tensions between the US and China, the impacts of Russia's war on Ukraine, tensions and conflict affecting Israel, and rising tensions between mainland China and Taiwan;
• the evolving market for products with AI capabilities;
• our complex global supply chain, including from disruptions, delays, trade tensions and conflicts, or shortages;
• product defects, errata and other product issues, particularly as we develop next-generation products and implement next-generation manufacturing process technologies;
• potential security vulnerabilities in our products;
• increasing and evolving cybersecurity threats and privacy risks;
• IP risks including related litigation and regulatory proceedings;
• the need to attract, retain, and motivate key talent;
• strategic transactions and investments;
• sales-related risks, including customer concentration and the use of distributors and other third parties;
• our significantly reduced return of capital in recent years;
• our debt obligations and our ability to access sources of capital;
• complex and evolving laws and regulations across many jurisdictions;
• fluctuations in currency exchange rates;
• changes in our effective tax rate;
• catastrophic events;
• environmental, health, safety, and product regulations;
• our initiatives and new legal requirements with respect to corporate responsibility matters; and
• other risks and uncertainties described in this release, our most recent Annual Report on Form 10-K and our other filings with the U.S. Securities and Exchange Commission (SEC).

All information in this release reflects management's expectations as of the date of this release, unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.

About Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com .