AMD Launches 5th Gen AMD EPYC CPUs, Maintaining Leadership Performance and Features for the Modern Data Center


Supporting Resources

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics, and visualization technologies. Billions of people, leading Fortune 500 businesses, and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work, and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD)  websiteblogLinkedIn and  X pages.

Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including AMD EPYC™ processors, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; loss of a significant customer; competitive markets in which AMD’s products are sold; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to introduce products on a timely basis with expected features and performance levels; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses;  impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

AMD, the AMD Arrow logo, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

1 EPYC-029C: Comparison based on thread density, performance, features, process technology and built-in security features of currently shipping servers as of 10/10/2024. EPYC 9005 series CPUs offer the highest thread density [EPYC-025B], leads the industry with 500+ performance world records [EPYC-023F] with performance world record enterprise leadership Java® ops/sec performance [EPYCWR-20241010-260], top HPC leadership with floating-point throughput performance [EPYCWR-2024-1010-381], AI end-to-end performance with TPCx-AI performance [EPYCWR-2024-1010-525] and highest energy efficiency scores [EPYCWR-20241010-326]. The 5th Gen EPYC series also has 50% more DDR5 memory channels [EPYC-033C] with 70% more memory bandwidth [EPYC-032C] and supports 70% more PCIe® Gen5 lanes for I/O throughput [EPYC-035C], has up to 5x the L3 cache/core [EPYC-043C] for faster data access, uses advanced 3-4nm technology, and offers Secure Memory Encryption + Secure Encrypted Virtualization (SEV) + SEV Encrypted State + SEV-Secure Nested Paging security features. See the AMD EPYC Architecture White Paper ( https://library.amd.com/l/3f4587d147382e2/) for more information.

2 AMD EPYC™ 9005 processors utilize the SP5 socket. Many factors determine system compatibility. Check with your server manufacturer to determine if this processor is supported in systems configured with previously launched AMD EPYC 9004 family CPUs.

3 EPYC-022F: For a complete list of world records see: http://amd.com/worldrecords.

4 9xx5-002C: SPECrate®2017_int_base comparison based on published scores from www.spec.org as of 10/10/2024.

2P AMD EPYC 9965 (3000 SPECrate®2017_int_base, 384 Total Cores, 500W TDP, $14,813 CPU $), 6.060 SPECrate®2017_int_base/CPU W, 0.205 SPECrate®2017_int_base/CPU $, https://www.spec.org/cpu2017/results/res2024q3/cpu2017-20240923-44833.html)

2P AMD EPYC 9755 (2720 SPECrate®2017_int_base, 256 Total Cores, 500W TDP, $12,984 CPU $), 5.440 SPECrate®2017_int_base/CPU W, 0.209 SPECrate®2017_int_base/CPU $, https://www.spec.org/cpu2017/results/res2024q4/cpu2017-20240923-44837.pdf)

2P AMD EPYC 9754 (1950 SPECrate®2017_int_base, 256 Total Cores, 360W TDP, $11,900 CPU $), 5.417 SPECrate®2017_int_base/CPU W, 0.164 SPECrate®2017_int_base/CPU $, https://www.spec.org/cpu2017/results/res2023q2/cpu2017-20230522-36617.html)

2P AMD EPYC 9654 (1810 SPECrate®2017_int_base, 192 Total Cores, 360W TDP, $11,805 CPU $), 5.028 SPECrate®2017_int_base/CPU W, 0.153 SPECrate®2017_int_base/CPU $, https://www.spec.org/cpu2017/results/res2024q1/cpu2017-20240129-40896.html)

2P Intel Xeon Platinum 8592+ (1130 SPECrate®2017_int_base, 128 Total Cores, 350W TDP, $11,600 CPU $) 3.229 SPECrate®2017_int_base/CPU W, 0.097 SPECrate®2017_int_base/CPU $, http://spec.org/cpu2017/results/res2023q4/cpu2017-20231127-40064.html)

2P Intel Xeon 6780E (1410 SPECrate®2017_int_base, 288 Total Cores, 330W TDP, $11,350 CPU $) 4.273 SPECrate®2017_int_base/CPU W, 0.124 SPECrate®2017_int_base/CPU $, https://spec.org/cpu2017/results/res2024q3/cpu2017-20240811-44406.html)

SPEC®, SPEC CPU®, and SPECrate® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information. Intel CPU TDP at https://ark.intel.com/.

5 GD-150: Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.

6 9xx5-001: Based on AMD internal testing as of 9/10/2024, geomean performance improvement (IPC) at fixed-frequency.

« Previous Page 1 | 2 | 3 | 4  Next Page »
Featured Video
Editorial
Jobs
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise