AMD Unveils Leadership AI Solutions at Advancing AI 2024

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics, and visualization technologies. Billions of people, leading Fortune 500 businesses, and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work, and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD)  websiteblogLinkedIn, and  X pages.

Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products; AMD’s expected data center and AI growth opportunities; the ability of AMD to build momentum for AMD EPYC™ and AMD Instinct™ processors across its customers; the ability of AMD to deliver leadership compute to power to its customers workloads; the anticipated growth of the data center AI accelerator market by 2028; and AMD’s commitment to delivering open innovation at scale, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; loss of a significant customer; competitive markets in which AMD’s products are sold; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to introduce products on a timely basis with expected features and performance levels; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses;  impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

AMD, the AMD Arrow logo, EPYC, AMD CDNA, AMD Instinct, Pensando, ROCm, Ryzen, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

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EPYC-022F: For a complete list of world records see: http://amd.com/worldrecords.
2 Testing conducted by internal AMD Performance Labs as of September 29, 2024 inference performance comparison between ROCm 6.2 software and ROCm 6.0 software on the systems with 8 AMD Instinct™ MI300X GPUs coupled with Llama 3.1-8B, Llama 3.1-70B, Mixtral-8x7B, Mixtral-8x22B, and Qwen 72B models.
ROCm 6.2 with vLLM 0.5.5 performance was measured against the performance with ROCm 6.0 with vLLM 0.3.3, and tests were performed across batch sizes of 1 to 256 and sequence lengths of 128 to 2048.
Configurations:
1P AMD EPYC™ 9534 CPU server with 8x AMD Instinct™ MI300X (192GB, 750W) GPUs, Supermicro AS-8125GS-TNMR2, NPS1 (1 NUMA per socket), 1.5 TiB (24 DIMMs, 4800 mts memory, 64 GiB/DIMM), 4x 3.49TB Micron 7450 storage, BIOS version: 1.8, , ROCm 6.2.0-00, vLLM 0.5.5, PyTorch 2.4.0, Ubuntu® 22.04 LTS with Linux kernel 5.15.0-119-generic.
vs.
1P AMD EPYC 9534 CPU server with 8x AMD Instinct™ MI300X (192GB, 750W) GPUs, Supermicro AS-8125GS-TNMR2, NPS1 (1 NUMA per socket), 1.5TiB 24 DIMMS, 4800 mts memory, 64 GiB/DIMM), 4x 3.49TB Micron 7450 storage, BIOS version: 1.8, ROCm 6.0.0-00, vLLM 0.3.3, PyTorch 2.1.1, Ubuntu 22.04 LTS with Linux kernel 5.15.0-119-generic. MI300-62
Server manufacturers may vary configurations, yielding different results. Performance may vary based on factors including but not limited to different versions of configurations, vLLM, and drivers.
3 Based on Microsoft Copilot+ requirements of minimum 40 TOPS using AMD product specifications and competitive products announced as of Oct 2024. Microsoft requirements found here - https://support.microsoft.com/en-us/topic/copilot-pc-hardware-requirements-35782169-6eab-4d63-a5c5-c498c3037364. STXP-05.
4 Based on a small node size for an x86 platform and cutting-edge, interconnected technologies, as of September 2024. GD-203b
5 Testing as of Sept 2024 by AMD performance labs using the following systems: HP EliteBook X G1a with AMD Ryzen AI 9 HX PRO 375 processor @40W, Radeon™ 890M graphics, 32GB of RAM, 512GB SSD, VBS=ON, Windows 11 Pro; Lenovo ThinkPad T14s Gen 6 with AMD Ryzen™ AI 7 PRO 360 processor @22W, Radeon™ 880M graphics, 32GB RAM, 1TB SSD, VBS=ON, Windows 11 Pro; Dell Latitude 7450 with Intel Core Ultra 7 165U processor @15W (vPro enabled), Intel Iris Xe Graphics, VBS=ON, 32GB RAM, 512GB NVMe SSD, Microsoft Windows 11 Professional; Dell Latitude 7450 with Intel Core Ultra 7 165H processor @28W (vPro enabled), Intel Iris Xe Graphics, VBS=ON, 16GB RAM, 512GB NVMe SSD, Microsoft Windows 11 Pro. The following applications were tested in Balanced Mode: Teams + Procyon Office Productivity, Teams + Procyon Office Productivity Excel, Teams + Procyon Office Productivity Outlook, Teams + Procyon Office Productivity Power Point, Teams + Procyon Office Productivity Word, Composite Geomean Score. Each Microsoft Teams call consists of 9 participants (3X3). Laptop manufactures may vary configurations yielding different results. STXP-10.
Testing as of Sept 2024 by AMD performance labs using the following systems: (1) Lenovo ThinkPad T14s Gen 6 with an AMD Ryzen™ AI 7 PRO 360 processor (@22W), Radeon™ 880M graphics, 32GB RAM, 1TB SSD, VBS=ON, Windows 11 Pro; (2) Dell Latitude 7450 with Intel Core Ultra 7 165U processor (@15W) (vPro enabled), Intel Iris Xe Graphics, VBS=ON, 32GB RAM, 512GB NVMe SSD, Microsoft Windows 11 Professional; and (3) Dell Latitude 7450 with Intel Core Ultra 7 165H processor (@28W) (vPro enabled), Intel Arc Graphics, VBS=ON, 16GB RAM, 512GB NVMe SSD, Microsoft Windows 11 Pro. Tested applications (in Balanced Mode) include: Procyon Office Productivity, Procyon Office Productivity Excel, Procyon Office Productivity Outlook, Procyon Office Productivity Power Point, Procyon Office Productivity Word, Composite Geomean Score. Laptop manufactures may vary configurations yielding different results. STXP-11.

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