STMicroelectronics Reports 2008 Second Quarter and First Half Revenues and Earnings

ASG posted strong net revenue growth of 15.9% and 8.4% in comparison to the year-ago and prior periods, respectively. ASG's operating profit improved sequentially largely due to mix improvement, while declining on a year-over- year basis driven by a combination of currency factors and increased R&D expenses coming from the Genesis and wireless IC design-team acquisitions as well as a higher level of design activity.

IMS sales also rose sharply, with net revenues increasing 12.8% year-over- year and 11.9% sequentially. IMS operating profit was $132 million, improving both sequentially and year-over-year, reflecting improved volume, mix - notably driven by product emphasis in Advanced Analog and ICs, - and efficiency, which more than offset currency impacts.

First Half 2008 Results

In this press release the income statement for the first half of 2008 incorporates FMG for the first three months of 2008.


    In Million US$ and %
        Net Revenues          First Half    First Half    Year-over-Year
                                 2008          2007           Growth

    ST ex FMG                   $4,570        $4,039           13.2%

    ST including FMG            $4,869        $4,693            3.8%

Net revenues for the first half were $4,570 million, increasing 13.2% compared to 2007 first half revenues of $4,039 million (excluding FMG). Gross profit increased 9.6% to $1,779 million, or 36.5% of net revenues, compared to $1,623 million or 34.6% of net revenues for the 2007 first half. Operating loss was $114 million, compared to operating loss of $710 million in last year's first half. Net loss was $131 million, or $-0.15 per share, compared to net loss of $684 million, or $-0.76 per share for the 2007 first half. Net loss included pre-tax restructuring, impairment charges and in-process R&D costs of $459 million ($0.45 per diluted share impact) and $918 million ($1.01 per diluted share impact) for the 2008 and 2007 first half results, respectively.

Research and development expenses were $978 million, including a $21 million in-process R&D charge associated with the closing of the Genesis Microchip acquisition, compared to $881 million in the 2007 first half. Selling, general, and administrative expenses were $585 million compared to $531 million in the 2007 first half.

In the 2008 first half, the effective average exchange rate for the Company was approximately $1.51 to euro 1.00, compared to $1.31 to euro 1.00 for the 2007 first half.

First Half 2008 Financial and Operating Data by Product Segment

    The following table provides a breakdown of revenues and operating income
by product segment.


    In Million US$ and %                              First Half 2008
                                                                    Operating
                                                  Net     % of Net    income
    Product Segment                             Revenues  Revenues    (loss)

    ASG (Application Specific Product Groups)    $2,904     59.7%       $42
    IMS (Industrial and Multisegment Sector)      1,637     33.6%       222
    FMG (Flash Memories Group)                      299      6.1%        16
    Others (1)(2)                                    29      0.6%      (394)

    TOTAL                                        $4,869      100%     $(114)

    (1) and (2) defined in earlier table.

Outlook

Mr. Bozotti stated, "Despite the current macroeconomic situation we expect ST's sequential net revenue growth to be in the range between -1% and 6%, which represents year-over-year growth of between 7% and 14%. The third quarter 2008 gross margin is expected to be equal to the second quarter level of 36.8%, plus or minus one percentage point."

This outlook is based on an assumed currency exchange rate of approximately $1.57 = euro 1.00 for the 2008 third quarter, which reflects current exchange rate levels combined with the impact of existing hedging contracts. Additionally, this outlook is provided for ST as currently configured and does not include any impact of the ST-NXP Wireless joint venture, which is expected to close in the 2008 third quarter. ST's third quarter 2008 results will also include the Company's pro-rata portion of Numonyx' second quarter 2008 financial performance in the income statement line 'Earnings(loss) on equity investment,' reflecting the anticipated one quarter lag in reporting.

    Recent Corporate Developments
    -- At the Company's Annual General Meeting, which was held in Amsterdam on
       May 14, 2008, all of the proposed resolutions were approved. The
       Company's 2007 accounts in accordance with International Financial
       Reporting Standards (IFRS) were approved. The shareholders reappointed
       the following members of the Supervisory Board: Mr. Gerald Arbola, Mr.
       Tom de Waard, Mr. Didier Lombard, Mr. Bruno Steve, in addition to
       appointing Mr. Antonino Turicchi, for three-year terms, expiring at the
       2011 Annual General Meeting. The distribution of a cash dividend of
       $0.36 per share, to be paid in four equal installments, was also
       approved.
        -- The complete Agenda and relevant detailed information concerning
           the STMicroelectronics N.V. Annual General Meeting, as well as all
           related AGM materials, is available on the Company's website
           http://investors.st.com

    -- On June 26, 2008, ST and NXP announced that the name of their new joint
       venture will be ST-NXP Wireless, following the announcement on April
       10, 2008, that the two companies would create a new company from their
              respective  mobile  and  wireless  businesses,  which  together  generated
              US$3  billion  in  revenue  in  2007.  The  management  team  of  ST-NXP  Wireless
              will  be  comprised  of  experienced  industry  leaders  from  both  parent
              companies,  with  Alain  Dutheil  leading  ST-NXP  Wireless  as  Chief
              Executive  Officer.  The  new  company  will  begin  operations  in  a  strong
              position  to  meet  customer  needs  in  2G,  2.5G,  3G,  multimedia,
              connectivity  and  future  wireless  technologies.

        --  On  June  30,  2008,  ST  published  its  2007  Corporate  Responsibility
              Report,  which  is  available  for  download  at  www.st.com/cr.  The  report,
              which  covers  all  of  ST's  activities  and  sites  in  2007,  contains
              detailed  indicators  of  the  Company's  performance  across  the  full  range
              of  Social,  Environmental,  Health  &  Safety,  and  Corporate  Governance
              issues  and  reaffirms  ST's  long-established  commitment  to  serving  its
              stakeholders  with  integrity,  transparency  and  excellence.


        Products,  Technology  and  Design  Wins

        Application-Specific  Product  Highlights
        --  In  wireless,  ST  announced  the  intention  to  develop  an  analog  baseband
              for  a  future  high-volume  EMP  (Ericsson  Mobile  Platforms)  platform,
              within  the  existing  partnership  between  the  two  companies.  This  effort
              builds  upon  the  successful  joint  development  and  the  start  of
              production  of  3G  and  3.5G  digital  baseband  processors  for  EMP's
              licensees.

        --  Also  in  the  wireless  area,  due  to  its  expertise  in  mobile  multimedia,
              ST  was  nominated  as  one  of  the  founding  members  of  the  Symbian
              Foundation,  along  with  other  major  leaders  in  the  mobile  handset
              industry.  The  intention  of  the  Foundation  is  to  unite  leading  operating
              systems  to  create  one  open  mobile  software  platform.  As  part  of  its
              membership,  ST  is  to  contribute  some  of  its  IP  and  reference  platforms
              to  the  foundation.

        --  In  communications  infrastructure  applications,  ST  gained  five  design
              wins  from  three  leading  OEMs  for  devices  implemented  in  65nm  process
              technology,  some  of  which  included  embedded  DRAM  and  other  analog
              options,  confirming  ST's  leading  position  in  delivering  CMOS-derivative
              process  technology  to  infrastructure  customers.

        --  In  imaging,  ST  introduced  a  new  high-performance  stand-alone  Image
              Signal  Processor  with  dual-camera  support  that  brings  DSC-like
              performance  to  cellphones,  PDAs,  gaming  devices  and  other  mobile
              applications.  Capable  of  controlling  the  entire  imaging  subsystem  in  a
              mobile  phone,  the  processor  supports  a  wide  range  of  modules  including
              sensors  with  up  to  5-megapixel  resolution.

        --  In  digital  consumer,  ST  continued  to  increase  shipments  of  its
              leading-edge  H.264  decoder  chips  for  the  worldwide  deployment  of
              high-definition  digital  set-top-boxes  and  integrated  digital  TVs.  ST
              has  also  sampled  four  different  products,  implemented  in  65nm,  to
              world-leading  manufacturers,  targeting  key  segments  of  the  set-top  box
              market.

        --  In  automotive,  ST  announced  the  first  four  32-bit  microcontrollers  in
              the  company's  new  Power  Architecture(TM)  families,  enabling  integrators
              to  use  the  MCUs  in  powertrain,  car  body,  chassis  and  safety,  and
              instrumentation  systems.  The  devices  will  support  advanced  functions,
              enable  improved  vehicle  performance  and  economy,  and  deliver
              development  savings  by  promoting  hardware  and  software  reuse.

        --  In  powertrain  applications,  ST  gained  a  significant  design  win  for  a
              dynamic  vehicle  control  and  ABS  (anti-lock  braking  system)  platform
              from  a  major  Japanese  car  maker.  Based  on  ST's  BCD8  smart-power
              process,  the  single-chip  products  will  serve  the  full  platform  from
              simple  ABS  solutions  for  low-  and  mid-level  cars  to  full  vehicle
              control  for  the  high-end  segment.  In  car  safety,  ST  and  Mobileye
              announced  that  the  two  companies  have  sampled  the  second  generation  of
              the  EyeQ2  system-on-chip  for  vision-based  driver  assistance  systems.  In
              addition,  ST  achieved  a  major  design  win  from  a  European  tier  one  OEM
              for  a  PSI5-protocol  IC,  which  provides  a  simplified  and  safer  interface
              between  the  airbag  sensor  and  car  diagnostics.  In  production  in  2009
              with  European,  American  and  Japanese  car  makers,  ST  will  be  the  first
              non-captive-market  vendor  with  an  IC  handling  the  PSI5  protocol.

        --  In  car-body  applications,  ST  gained  major  design  wins,  including  a
              door-module  chipset  in  the  US  market  and  for  smart  actuators  in
              body-control  modules  in  China  and  India.  ST  also  achieved  several
              design-ins  at  tier  one  OEMs  worldwide  for  8-  and  32-bit  MCUs.

        --  In  car  communications,  ST  signed  an  agreement  with  WorldSpace(R)
              Satellite  Radio  to  develop,  manufacture  and  distribute  chips  for
              European  Satellite  Digital  Radio  receivers  for  a  pan-European  and
              Middle  East  service  offering.  Also,  ST  started  production  of  its
              Nomadik-platform-based  Cartesio  automotive-grade  application  processor
              with  embedded  GPS  for  three  customers  for  telematics,  handheld  and
              Personal  Navigation  Device  (PND)  applications.  Additionally,  ST  gained
              a  design  win  for  an  AM/FM  tuner  IC  at  a  major  US  OEM  and  a  tuner
              design-in  at  a  major  Japanese  car  radio  maker,  plus  design  wins  for
              audio  power  chips  with  a  Japanese  car  radio  maker  and  major  US  car
              manufacturers.

        --  In  computer  peripherals,  ST  gained  two  design  wins  in  the  US  for  its
              SPEAr(R)  family  of  configurable  System  on-Chip  (SoC)  ICs,  in  printers
              and  networking  applications.  Additionally,  ST  announced  a  new  device  in
              the  family:  manufactured  in  state-of-the-art  low-power  65nm  technology,
              SPEAr  Basic  addresses  various  embedded  applications,  including
              entry-level  printers,  digital  photo  frames,  Voice-over-IP  and  other
              equipment.

        --  In  healthcare  applications,  ST  and  Debiotech  introduced  the  first
              evaluation  prototypes  of  a  unique  miniaturized  insulin-delivery  pump.
              The  device,  which  could  be  a  couple  of  years  away  from  commercial
              availability,  relies  on  microfluidic  MEMS  technology  and  can  be  mounted
              on  a  disposable  skin  patch  to  provide  continuous  insulin  infusion,
              enabling  substantial  advancements  in  the  availability,  treatment
              efficiency  and  the  quality  of  life  of  diabetes  patients.


        Industrial  and  Multi-Segment  Product  Highlights
        --  In  32-bit  microcontrollers,  ST  increased  the  scalability  and  peripheral
              options  of  its  breakthrough  32-bit  STM32  Cortex(TM)-M3  MCU  family  with
              devices  providing  up  to  512  Kbytes  of  on-chip  Flash,  larger  SRAM  and
              extra  features  for  displays,  sound,  storage  and  advanced  control,  and
              multiple  power-saving  modes  for  optimal  performance  in  industrial
              equipment,  building-services  controllers,  medical  devices  and  computer
              peripherals.  In  8-bit  MCUs,  ST  launched  a  range  of  MCUs,  based  on  the
              STM8  core  and  specified  for  the  industrial  temperature  range,  that
              boasts  extra  features  for  robustness  and  reliability.

        --  In  MEMS,  in  addition  to  gaining  two  significant  design  wins  for  sensors
              in  game  controllers  and  another  in  a  consumer  application,  ST
              introduced  a  number  of  important  new  products,  including  its  first
              'Gyroscope'  angular-rate  sensors,  which  offer  an  extended  voltage  range
              and  reduced  standby  power  for  applications  such  as  game  controllers,
              intuitive  pointers,  vehicle  or  personal  navigation,  and  image
              stabilization.

        --  Also  in  MEMS,  ST  announced  the  first  in  a  new  family  of  3D  orientation
              sensors  that  embed  both  3D  orientation  functionality  and  click/double-
              click  detection,  allowing  developers  to  integrate  mouse-button
              controls.  ST  also  added  two  new  high-performance  accelerometers  to  its
              ultra-compact  portfolio  for  super-small  applications  where  high
              performance  is  required  in  space-constrained  applications,  including
              mobile  phones,  portable  media  players,  digital  still  or  video  cameras,
              and  personal  navigation  devices.

        --  For  power  conversion  markets,  ST  gained  a  significant  design  win  with  a
              major  power-supply  manufacturer  for  a  Halogen-free  product  kit  and  also
              ramped  up  production  of  power-converter  and  regulators  ICs  for  several
              PC  notebook  applications  from  major  customers  in  the  US  and  Asia.  ST
              also  introduced  new  products  including  the  VIPer17  off-line
              switched-mode  converter,  step-up  converters  for  LED  backlights  and
              lighting,  and  a  new  multi-output  regulator  aimed  at  a  range  of  PC  and
              consumer  products.

        --  Also  in  power  applications,  ST  gained  several  design  wins  for  MOSFETS
              including  high-end  desktop  PCs  for  a  major  customer  and  applications  in
              automotive  and  lighting.  ST  also  announced  a  family  of  FDmesh(TM)  II
              fast-recovery  MOSFETs  that  combine  enhanced  switching  performance  with
              on-resistance  improved  by  more  than  18%  over  existing  devices.  And  in
              bipolar  and  IGBTs,  ST  gained  numerous  design  wins  in  industrial,
              medical  and  audio  applications  and  introduced  a  new  ESBT  switch  for
              power  supplies  for  single-  and  three-phase  applications  and  a
              PowerMESH(TM)  IGBT  for  use  in  energy-sensitive  circuits  such  as
              lighting  ballasts.

        --  In  application-specific  discretes  and  IPADs(TM)  (Integrated  Passive  and
              Active  Devices),  ST  introduced  into  the  home-appliance  market  a
              solid-state  AC-switch  driver  that  integrates  switch-failure  detection,
              allowing  designers  to  save  board  space  and  simplify  the  process  to  meet
              various  international  safety  standards.  In  telecom  and  consumer
              applications,  ST  enlarged  its  IPAD  range  of  combined  ESD  protection  and
              EMI  filtering  products  dedicated  to  audio  functions,  and  also
              introduced  protection  devices  dedicated  to  USB2.0  and  Ethernet  to  meet
              increasing  data  rates  in  connectivity  and  wireline  applications.

        --  In  analog  products,  ST  introduced  a  range  of  new  devices  including
              interfaces  and  amplifiers  and  achieved  numerous  design  wins  in  a  range
              of  applications,  such  as  mobile  phone  audio  for  a  world-leading
              manufacturer  and  use  in  data-storage  products  for  two  important
              customers.  And  in  advanced  analog  and  mixed-signal,  ST  announced  a  new
              family  of  silicon  oscillators  and  a  range  of  four-  and  five-channel
              voltage  supervisors  for  computer,  consumer  and  communications
              applications,  in  addition  to  picking  up  several  design  wins  and  product
              qualifications  in  the  advanced  analog  field  from  world-leading  makers
              of  mobile  phones,  computer  and  PNDs.

        --  In  advanced  logic,  ST  gained  numerous  design  wins  for  logic  switches
              and  translators  in  computer  and  communications  applications  from  major
              notebook  and  mobile  phone  manufacturers.  ST  also  announced  a  new
              touch-screen  controller  IC  that  offers  autonomous  functionality  to
              minimize  demands  on  the  system  processor  in  applications  such  as  PDAs,
              mobile  phones,  GPS  receivers,  game  consoles  and  POS  terminals.


        Technology  Highlights
        --  ST  announced  the  deployment  of  a  certified  electronic  system-level
              (ESL)  System-on-Chip  reference  design  flow  aimed  at  complex  designs  for
              next-generation  consumer  electronics  equipment.    The  design  flow  has
              been  adopted  and  internally  distributed  following  successful  tape-outs
              of  more  than  a  dozen  ASIC  designs  with  productivity  gains  from  four  to
              ten  times  faster  than  with  traditional  methods.

        --  ST  and  CMP  (Circuits  Multi  Projects(R))  announced  that  the  two
              companies  are  offering  Chinese  universities  access  to  ST's  most
              advanced  CMOS  processes  for  academic  and  research  purposes.  ST  will
              ensure  the  certification  of  the  local  partners  and  the  fabrication  of
              the  ICs  designed  by  the  universities,  while  CMP  will  be  the  interface
              for  commercial  and  technical  aspects.

 


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