Mobile Memory
Silicon test demonstration of a collection of high-bandwidth, low-power memory technologies targeted at achieving data rates of 4.3Gbps at best-in-class power efficiency. With this performance, designers could realize more than 17GB/s of memory bandwidth from a single mobile DRAM device.
Graphics Memory
Silicon demonstration of a complete XDR™ memory system running at data rates up to 7.2Gbps with superior power efficiency. The XIO memory controller demonstrates bi-modal operation with support for both XDR DRAM as well as next-generation XDR2 DRAM.
Computing Memory
Video demonstration of a set of innovations that can advance computing main memory beyond current DDR3 data rate limits to 3200Mbps. Key innovations include: Near Ground Signaling — supports high performance at greatly reduced IO power; FlexClocking™ Architecture — introduced in Rambus’ Mobile Memory Initiative, reduces clocking power by eliminating the need for a DLL or PLL on the DRAM; Module Threading — increases memory efficiency and reduces DRAM core power, and when combined with Near Ground Signaling and FlexClocking technology, can cut total memory system power by over 40 percent.
Rambus will also showcase the recently-announced module prototype co-developed with Kingston Memory, using DDR3 DRAM technology and Rambus’ Module Threading technology. In this prototype, initial silicon results show an improvement in data throughput of up to 50 percent, while reducing power consumption by 20 percent compared to conventional modules.
For more information on the XDR memory architecture, please visit www.rambus.com/xdr.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.
Rambus and the Rambus logo are registered trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.
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