Please refer to the link for the index charts: http://www.tsmc.com/uploadfile/ir/quarterly/index_charts.pdf
V. CapEx & Capacity
V - 1. Capital Expenditures
(In US millions) 1Q09 2Q09 3Q09 YTD
TSMC 161 218 963 1342
XinTec and GUC 2 3 6 11
TSMC Shanghai & WaferTech 3 3 0 6
Other TSMC Subsidiaries 0 0 2 2
Total TSMC 166 224 971 1361
Capital Expenditures:
Capital expenditures for TSMC on a consolidated basis totaled US$971 million in 3Q09.
First quarter through third quarter 2009, total capital expenditures reached US$1.36 billion. Due to stronger demand for 40nm and 65nm technologies, TSMC 2009 capital expenditures are further raised and expected to be around US$2.7 billion.
V - 2. Capacity
2008 1Q09 2Q09 3Q09 4Q09 2009
Fab / (Wafer size) (A) (A) (A) (A) (F) (F)
Fab-2 (6") Note 1 1,056 274 280 283 283 1,121
Fab-3 (8") 1,100 286 289 292 283 1,150
Fab-5 (8") 650 162 149 144 144 599
Fab-6 (8") 1,082 295 284 287 287 1,154
Fab-8 (8") 1,076 275 271 265 255 1,066
Fab-12 (12") Note 2 840 218 219 199 243 879
Fab-14 (12") Note 2 818 238 238 239 243 958
WaferTech (8") 420 106 107 109 109 431
TSMC China (8") 453 128 134 135 135 531
TSMC total capacity (8"
equiv. Kpcs) 9,104 2,431 2,419 2,379 2,467 9,695
SSMC (8") 272 64 65 65 65 259
Total managed capacity (8"
equiv. Kpcs) 9,377 2,495 2,483 2,444 2,532 9,955
Note: 1. Figures represent number of 6" wafers. Conversion to
8"-equivalent wafers is obtained by dividing this number by 1.78
2. Figures represent number of 12" wafers. Conversion to
8"-equivalent wafers is obtained by multiplying this number by
2.25
Capacity:
Total managed capacity was 2,444K 8-inch equivalent wafers in the third quarter, decreased by 1.6% from 2,483K in 2Q09, mainly due to capacity migration to advanced nodes.
TSMC managed capacity in 4Q09 is expected to increase by 3.6% to reach 2,532K 8-inch equivalent wafers.
Total managed capacity in 2009 is expected to reach 9,955K 8-inch equivalent wafers, representing an increase of 6.2% from 9,377K 8-inch equivalent wafers in 2008, while capacity for 12-inch wafer fabs is expected to increase by 11% year-over-year, reaching 42% of total capacity.
VI. Recap of Recent Important Events & Announcements
-- TSMC Collaborates With Suppliers To Complete Taiwan's First Supply
Chain Carbon Inventory. (2009/09/21)
-- Fujitsu Microelectronics and TSMC To Collaborate On 28nm Process
Technology. (2009/08/27)
-- TSMC Has Become the First Foundry Not Only To Achieve 28nm Functional
64Mb SRAM Yield, But Also To Achieve It Across All Three 28nm Nodes.
(2009/8/24)
-- TSMC Adds High-K Metal Gate Low Power Process To 28nm Road Map. Risk
Production Is Expected In Q3 2010. (2009/08/24)
-- IDT And TSMC Enter Product Fabrication Agreement. (2009/08/06)
-- TSMC Extends Design Methodology Leadership To 28nm With Reference Flow
10.0. (2009/07/22)
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
Consolidated Condensed Balance Sheets
(Expressed in Millions of New Taiwan Dollars (NTD) and U.S. Dollars (USD)) (1)
September 30, 2009 June 30, 2009
(unaudited) (audited)
ASSETS USD NTD % NTD %
Current Assets
Cash and Cash Equivalents $4,874 $156,935 29.0 $239,517 40.8
Investments in Marketable
Financial Instruments 726 23,384 4.3 7,252 1.2
Accounts Receivable - Trade 1,114 35,881 6.6 33,384 5.7
Inventories, Net 596 19,176 3.5 18,974 3.2
Other Current Assets 275 8,865 1.7 10,292 1.8
Total Current Assets 7,585 244,241 45.1 309,419 52.7
Long-Term Investments 1,197 38,553 7.1 32,498 5.5
Properties, Plant and
Equipment 28,318 911,844 168.3 881,897 150.1
Less: Accumulated
Depreciation (20,963) (675,028) (124.6) (656,826) (111.8)
Properties, Plant and
Equipment, Net 7,355 236,816 43.7 225,071 38.3
Other Assets 692 22,287 4.1 20,555 3.5
Total Assets $16,829 $541,897 100.0 $587,543 100.0
LIABILITIES AND SHAREHOLDERS'
EQUITY
Current Liabilities
Accounts Payables $330 $10,633 2.0 $10,105 1.7
Payables to Contractors and
Equipment Suppliers 486 15,666 2.9 15,853 2.7
Accrued Expenses and Other
Current Liabilities 882 28,401 5.2 103,363 17.6
Current Portion of Bonds
Payable and Long-Term
Debts 10 309 0.1 309 0.1
Total Current Liabilities 1,708 55,009 10.2 129,630 22.1
Bonds Payable 140 4,500 0.8 4,500 0.8
Other Long-Term Liabilities 489 15,761 2.9 16,060 2.7
Total Liabilities 2,337 75,270 13.9 150,190 25.6
Shareholders' Equity
Attributable to Shareholders
of the Parent
Capital Stock at Par Value 8,044 259,007 47.8 258,964 44.1
Capital Surplus 1,722 55,440 10.2 55,331 9.4
Legal Capital Reserve (2) 2,401 77,317 14.3 77,317 13.2
Special Capital Reserve (2) -- -- -- -- --
Unappropriated Earnings (2) 2,233 71,899 13.3 41,348 7.0
Treasury Stock -- -- -- -- --
Others (24) (778) (0.2) 801 0.1
Total Equity
Attributable to
Shareholders of the
Parent 14,376 462,885 85.4 433,761 73.8
Minority Interests 116 3,742 0.7 3,592 0.6
Total Shareholders'
Equity 14,492 466,627 86.1 437,353 74.4
Total Liabilities &
Shareholders' Equity $16,829 $541,897 100.0 $587,543 100.0
Note:
(1) Amounts in New Taiwan dollars have been translated into U.S. dollars
at the rate of NT$32.2 as of September 30, 2009.
(2) Certain prior period balances have been reclassified to conform to
the current period presentation.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
Consolidated Condensed Balance Sheets 
