Compact, Modular Architecture Extends MicroCloud X10 Family Delivering Performance, Energy Efficiency and Ease of Maintenance for a Wide Range of Applications in Enterprise, Data Center, Cloud and HPC Environments

SAN JOSE, Calif., May 11, 2015 — (PRNewswire) —  Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing debuts a new 3U 8-node MicroCloud solution ( SYS-5038MR-H8TRF) supporting Intel® Xeon® E5-2600 v3 (up to 145W TDP) optimized for data intensive analytics applications in Oil and Gas exploration and HPC environments. Each node of this new solution features 2x 3.5" hot-swap SATA3/SAS drive bays, 1x PCI-E 3.0 (x8) low-profile (LP) slot, up to 256GB LRDIMM, 128GB RDIMM, up to 2133MHz DDR4 ECC; 4x DIMMs, 2x GbE LAN ports, 1x dedicated LAN for IPMI Remote Management. It also incorporates Supermicro's Green Computing architecture advantages with 4x 8cm heavy duty hot-swap fans featuring optimal cooling zone and 1620W Redundant Platinum Level high-efficiency (95%) digital power supplies. The complete solution maximizes compute performance, density, and energy efficiency within a highly compact, modular easily serviceable form factor. The new performance based SYS-5038MR-H8TRF joins its latest Intel® Xeon® E3-1200 v3 and Intel® Atom™ C2750 based 24/12/8-node systems targeting web host, collocation services, cache server, CDN, video streaming, social networking and mobile applications, extending the 3U MicroCloud family to cover the widest range of applications across Enterprise, Data Center, Cloud and HPC environments.

"Supermicro's new X10 8-node MicroCloud supporting the Intel Xeon E5-2600 v3 processor family extends our solution coverage to the performance end of the spectrum, particularly for VDI, mobile applications, HPC and data analytics environments," said Charles Liang, President and CEO of Supermicro. "Our MicroCloud product family now covers the widest range of applications from top end of performance to mid-range enterprise applications, and extreme low-power energy-efficient appliances in a compact, modular 3U foot print."

3U MicroCloud Product Specifications

• NEW 8-Node ( SYS-5038MR-H8TRF) – 8x sleds, each supporting a single Intel® Xeon® processor E5-2600 v3 (up to 145W TDP), 2x 3.5" hot-swap SATA3/SAS drive bays; SAS requires RAID/HBA AOC, 1x PCI-E 3.0 x8 LP slot, up to 256GB LRDIMM/128GB RDIMM, up to 2133MHz DDR4 ECC; 4x DIMMs, 2x GbE LAN ports via Intel® i350, 1x dedicated LAN for IPMI Remote Management. Chassis supports 4x 8cm heavy duty fans with optimal cooling zone, 1620W Redundant Platinum Level high-efficiency (95%) digital power supplies. H 5.21" (132.5 mm) x W 17.26" (438.4 mm) x D 23.2" (589 mm)
• 24-Node ( SYS-5038ML-H24TRF) – 12x sleds, 2x nodes per sled each supporting a single Intel® Xeon® processor E3-1200 v3 or Intel® 4th Gen Core™ family processor (up to 80W TDP), 2x 2.5" SATA3 (6Gb/s) HDDs or 4x 2.5" Slim SSD with optional kit, up to 32GB DDR3 VLP ECC UDIMM 1600MHz support in 4 sockets, 4x GbE LAN (Intel i350), 1x shared LAN for IPMI Remote Management, shared 1x VGA, 1x COM ports, 2x USB 2.0 (with KVM dongle), Chassis supports 4x 9cm heavy duty hot-swap fans with optimal cooling zone, 2000W redundant Platinum Level high-efficiency (95%) digital power supplies. H 5.21" (132.5 mm) x W 17.5" (444.5 mm) x D 31.15" (791.2 mm) 
• 12-Node ( SYS-5038ML-H12TRF) – 12x sleds, 1x nodes per sled each supporting a single Intel® Xeon® E3-1200 v3, 4th Gen Core™ i3, Pentium or Celeron processor; Socket H3 (LGA 1150), 2x 3.5 or 4x 2.5" SATA3 HDDs with optional kit up to 32GB DDR3 VLP ECC UDIMM 1600/1333MHz support in 4 sockets, 2x GbE LAN (Intel i350), 1x dedicated LAN for IPMI Remote Management, 1x VGA, 1x COM ports, 2x USB 2.0 (with KVM dongle) Chassis supports 4x 9cm heavy duty hot-swap fans with optimal cooling zone, 1620W Redundant Platinum Level high-efficiency (95%) digital power supplies. H 5.21" (132.5 mm) x W 17.5" (444.5 mm) x D 29.5" (749.3 mm) 
• 8-Node ( SYS-5038ML-H8TRF) – 8x sleds, each supporting a single Intel® Xeon® E3-1200 v3, 4th Gen Core™ i3, Pentium or Celeron processors, 2x 3.5" SAS/SATA HDDs, up to 32GB DDR3 ECC UDIMM 1600/1333MHz support in 4 sockets, 2x GbE LAN (Intel i350), 1x dedicated LAN for IPMI Remote Management, 1x PCI-E 3.0 x8 and 1x Micro-LP, 1x VGA, 1x COM ports, 2x USB 2.0 (with KVM dongle). Chassis supports 4x 8cm heavy duty fans with optimal cooling zone, 1620W Redundant Platinum Level high-efficiency (95%) digital power supplies. H 5.21" (132.5 mm) x W 17.26" (438.4 mm) x D 23.2" (589 mm)
• 24-Node ( SYS-5038MA-H24TRF) – 12x sleds, 2x nodes per sled each supporting dual Intel® Atom processor C2750, SoC, FCBGA 1283, 20W 8-Core, 2x 2.5" SATA3 (6Gb/s) HDDs per node, up to 64GB DDR3 VLP ECC UDIMM, 1600MHz support in 4 sockets, 2x GbE LAN (Intel i354), 1x shared LAN for IPMI Remote Management, shared 1x VGA, 1x COM ports, 2x USB 2.0 (with KVM dongle). Chassis supports 4x 9cm heavy duty, hot-swap fans with optimal cooling zone, 1600W Redundant Platinum Level high-efficiency (95%) digital power supplies. H 5.21" (132.5 mm) x W 17.5" (444.5 mm) x D 29.5" (749.3 mm) 

For more information on Supermicro's complete line of compact, modular 3U MicroCloud solutions, visit www.supermicro.com/MicroCloud.

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About Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

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