Company to Feature Sony PlayStation®3 Slim in XDR™ Memory Product Showcase

SAN FRANCISCO — (BUSINESS WIRE) — September 21, 2009 — Rambus Inc. (NASDAQ: RMBS):

Join Rambus Inc., one of the world’s premier technology licensing companies specializing in high-speed memory architectures, at the Intel Developer Forum 2009 for a presentation on memory architectures for multi-core computing. In addition, Rambus will exhibit end-user products utilizing its award-winning XDR™ memory architecture.

Rambus Presentation

Tuesday, September 22, 11:15 a.m. PDT
“Memory Architectures for Multi-core Computing in Next-generation PCs and Smartphones”
Presented by Craig Hampel, Rambus Fellow
Moscone Center West, Room 2005

Mr. Hampel will address memory architecture optimizations that can support the many threads and workloads handled by multi-core processors in next-generation PCs and Smartphones. As part of his talk, Mr. Hampel will discuss innovations that can significantly improve memory throughput and reduce power consumption.

Rambus Demos and Displays

The XDR Product Showcase will exhibit low-power, power-efficient, and multi-core designs in some of today’s most compelling electronics products including:

• PlayStation®3 (PS3™) Slim live demo and open demo board, featuring the XDR memory architecture. The Rambus XDR memory interface and FlexIO™ processor bus on the Cell Broadband Engine™ enable an unprecedented aggregate bandwidth of over 65GB/s in the PS3.
• TI DLP® projector open demo board, featuring the XDR memory architecture. This architecture, including XDR DRAM, XDR memory controller (XMC), XDR IO cell (XIO), and XDR clock generator (XCG), delivers memory bandwidth up to 8.0GB/s in the latest generation of HD front projectors.
• PC-over-IP® (PCoIP) open demo boards of both Host and Portal products powered by Teradici’s TERA processors and the XDR memory architecture.
• Toshiba Qosmio® laptop PC featuring the SpursEngine video processor and XDR DRAM.